Document Library

• USB 3.0 CDR Model

• USB Latency Requirements and the Effect of Video Adapter PCI Retry Condition on Maintaining USB Streaming Pipelines

• USB 3.0 Electrical Compliance Methodology

• Micro-USB Cables and Connectors v1.01 Spec
• Adopters Agreement

• USB Interface Association Descriptor Device Class Code and Use Model

• USB 3.0 Jitter Budgeting

• Electrical Isolation and Improved Electromagnetic Compatibility for Personal Healthcare Devices using USB

1.  USB Power Delivery Specification Revision 2.0 Version 1.3 and corresponding Adopters Agreement

2.  USB Power Delivery Specification Revision 3.0 Version 2.0, August 29, 2019

• Managing Connector and Cable Assembly Performance for USB SuperSpeed

• A Standard for Host-Side Certified Wireless USB Connection Context Storage on Windows Operating Systems

• Power Delivery Design Issues for Hi-Speed USB on Motherboards

• USB PS Interface White Paper

• An Analysis of Wireless Device Implementations on USB

• An Introduction to Hi-Speed USB

• Cyclic Redundancy Checks in USB

• USB 2.0 Adopters Agreement

• Design Guide for a low speed buffer for USB

• USB 2.0 On-The-Go Specification Supplement Adopters Agreement

• Designing a Robust USB Serial Interface Engine (SIE)

1. The Original USB 2.0 specification released on April 27, 2000
2. USB 2.0 Adopters Agreement
3. Errata to the USB 2.0 specification as of December 7, 2000
4. Mini-B connector Engineering Change Notice to the USB 2.0 specification
5. Pull-up/pull-down Resistors Engineering Change Notice to the USB 2.0 specification
6. Errata to the USB 2.0 specification as of May 28, 2002
7. Interface Association Descriptor Engineering Change Notice to the USB 2.0 specification
8. Rounded Chamfer Engineering Change Notice to the USB 2.0 specification as of October 8, 2003
9. Unicode Engineering Change Notice to the USB 2.0 specification as of February 21, 2005
10. Inter-Chip USB Supplement Revision 1.0 as of March 13, 2006
11. Micro-USB Cables and Connectors Specification Revision 1.01 as of April 4, 2007 and corresponding Adopters Agreement
12. USB 2.0 Link Power Management Addendum Engineering Change Notice to the USB 2.0 specification as of July 16, 2007
13. High-Speed Inter-Chip USB Electrical Specification Revision 1.0 as of September 23, 2007
14. Suspend Current Limit Changes Engineering Change Notice to the USB 2.0 Specification as of April 9, 2008
15. 5V Short Circuit Withstand Requirement Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
16. Device Capacitance Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
17. Material Change Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
18. USB 2.0 Phase-locked SOFs Engineering Change Notice to the USB 2.0 Specification as of December 22, 2008
19. Micro-USB Micro-B ID Pin Resistance and Tolerance stack-up between D+ and D- Engineering Change Notice to the MicroUSB Specification to the USB 2.0 Specification, Revision 1.01 as of December 22, 2008
20. Quad Type Cable Additional for Micro USB ECN as of December 29, 2009
21. Clarification on the Chamfer on USB 2.0 Micro Connectors ECN as of March 23, 2010
22. Maximum Unmating Force Value Definition to USB 2.0 Micro Connectors ECN as of March 23, 2010
23. "On-The-Go Supplement to the USB 2.0 Specification" Adopters Agreement
24. USB TEST_MODE Selector Values ECN as of July 26, 2010
25. Errata for USB 2.0 ECN:  Link Power Management (LPM) - 7/2007 as of October 11, 2011
26. On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification, Revision 2.0 version 1.1a as of July 27, 2012
27. HSIC ECN as of May 21, 2012
28. USB 2.0 Connect Timing ECN Update as of April 4, 2013
29. HSIC Disconnect Supplement ECN as of September 18, 2013
30. USB 2.0 VBUS Max Limit ECN as of August 11, 2014
31. USB OTG EH ECN Maximum Vbus Voltage dated November 26, 2014

• Low Voltage Inter-Chip Adopters Agreement Amendment

• USB 3.1/USB Type-C(TM) Desktop Front Panel Cable and Connector Implementation Document

• Handling The IRP_MN_START_DEVICE PnP IRP v.1.0

• High-Speed Inter-Chip Adopters Agreement Amendment

• Methodology Used to Determine SuperSpeed USB 10 Gbps (USB 3.1) - Gen2 Channel and Cable Assembly High Speed Compliance

• HID Parser Error Checking

Embedded USB2 (eUSB2) Physical Layer Supplement to the USB Revision 2.0 Specification, Rev. 1.1

• USB 3.0 Adopters Agreement

• Propagation Delay between Host Transceivers and Downstream Ports

• On-Board USB connections for Digital Media Devices vs. Removable Media and Readers

• USB 3.1 Channel Loss Budgets

• System Test Implementers Forum

• USB 3.1 Reference Channel Models

• Understanding WDM Power Management v1.1

• USB 3.0 Radio Frequency Interference Impact on 2.4 GHz Wireless Devices